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Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror

: Wolter, A.; Schenk, H.; Korth, H.; Lakner, H.


Tanner, D.M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Reliability, testing, and characterization of MEMS/MOEMS III : 26 - 28 January 2004, San Jose, California, USA. SPIE Conference on Reliability, Testing, and Characterization of MEMS/MOEMS
Bellingham/Wash.: SPIE, 2004 (SPIE Proceedings Series 5343)
ISBN: 0-8194-5251-3
Conference on Reliability, Testing, and Characterization of MEMS/MOEMS <3, 2004, San José/Calif.>
Fraunhofer IPMS ()
micro scanning mirror; beam deflection; bulk-micromachining; MEMS; MOEMS; micro mirror; comb drive; torsional stress; fracture stress; silicon hinge

Special micro scanning mirrors have been designed for the investigation of torsional stress in micro-scale hinges made of crystalline silicon. The setup with precise logging of resonant frequency and deflection amplitude of the MEMS-scanners is described. First results on fatigue and fracture strenght are presented.
Fracture of torsion beams with 6.6 µm x 30 µm cross-section occured at 2.0 GPa to 2.4 GPa. No sign of fatigue was observed in operation for 512 h at 1.4 GPa torsional stress in resonance at 2260.7 Hz oscillation frequency. Measured frequency variation was 0.06 % without any trend.