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Mechanical characterisation and modelling of thin chips

 
: Schoenfelder, S.; Bagdahn, J.; Petzold, M.

:

Burghartz, J. (Ed.):
Ultra-thin chip technology and applications
Berlin: Springer, 2011
ISBN: 978-1-4419-7275-0
S.195-218
Englisch
Aufsatz in Buch
Fraunhofer CSP ()

Abstract
In order to ensure reliable products, electronic, as well as mechanical, properties of thin chips must also be characterised. In particular, the strength of silicon devices is an important key for improvement of the yield and avoidance of the fracture of silicon chips and devices in manufacturing and application, respectively. This chapter discusses strength parameter in detail and how strength of thin silicon chips can be analysed. Besides theoretical relations, examples of strength behaviour of thin silicon chips are presented regarding different manufacturing steps.

: http://publica.fraunhofer.de/dokumente/N-209283.html