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Passive alignment and soldering technique for optical components

 
: Faidel, H.; Gronloh, B.; Winzen, M.; Liermann, E.; Esser, D.; Morasch, V.; Luttmann, J.; Leers, M.; Hoffmann, D.

:

Clarkson, W.A. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Solid state lasers XXI. Technology and devices : 22 - 25 January 2012, San Francisco, California, United States
Bellingham, WA: SPIE, 2012 (SPIE Proceedings 8235)
ISBN: 978-0-8194-8878-7
ISSN: 0038-7355
Paper 82351I, 10 S.
Conference "Solid State Lasers - Technology and Devices" <21, 2012, San Francisco/Calif.>
Photonics West Conference <2012, San Francisco/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer ILT ()

Abstract
The passive-alignment-packaging technique presented in this work provides a method for mounting tolerance-insensitive optical components e.g. non-linear crystals by means of mechanical stops. The requested tolerances for the angle deviation are ±100 µrad and for the position tolerance ±100 µm. Only the angle tolerances were investigated, because they are more critical. The measurements were carried out with an autocollimator. Fused silica components were used for test series. A solder investigation was carried out. Different types of solder were tested. Due to good solderability on air and low induced stress in optical components, Sn based solders were indicated as the most suitable solders. In addition several concepts of reflow soldering configuration were realized. In the first iteration a system with only the alignment of the yaw angle was implemented. The deviation for all materials after the thermal and mechanical cycling was within the tolerances. The solderability of BBO and LBO crystals was investigated and concepts for mounting were developed.

: http://publica.fraunhofer.de/dokumente/N-209253.html