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Ultra-thin wafer fabrication through dicing-by-thinning

: Landesberger, C.; Scherbaum, S.; Bock, K.


Burghartz, J. (Ed.):
Ultra-thin chip technology and applications
Berlin: Springer, 2011
ISBN: 978-1-4419-7275-0
Aufsatz in Buch
Fraunhofer IZM ()

The technological concept 'dicing-by-thinning' (DbyT) offers a new technique for die separation for ultra-thin wafers. Conventional sawing is replaced by preparation of frontside trenches and subsequent backside thinning. It will be shown that introducing plasma etched trenches allows for both preparation of ultra-thin dies of high fracture strength and for a significant increase in number of chips per wafer. It is concluded that dicing-by-thinning offers a new strategy for cost effective manufacture of very small and ultra-thin radio frequency identification (RFID) devices. Finally, a short outlook on the development of self-assembly processes for ultra-thin microelectronic components will be given.