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Substrate handling techniques for thin wafer processing

 
: Landesberger, C.; Scherbaum, S.; Bock, K.

:

Burghartz, J. (Ed.):
Ultra-thin chip technology and applications
Berlin: Springer, 2011
ISBN: 978-1-4419-7275-0
S.125-138
Englisch
Aufsatz in Buch
Fraunhofer IZM ()

Abstract
This chapter describes the necessity that carrier techniques be developed for thin wafer handling and processing. After an explanation on the main requirements for handle substrate techniques, we give an overview on the following temporary bonding techniques and mechanisms: thermoplastic adhesives, release layers, soluble glues, reversible tapes, mechanical debonding and electrostatic bonding. Finally, we conclude that the development of appropriate carrier techniques for ultra-thin wafers represents a key element of future thin wafer technology.

: http://publica.fraunhofer.de/dokumente/N-209234.html