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Three-dimensional deformation analysis of MEMS/NEMS by means of X-ray computer-tomography

: Hammacher, J.; Dost, M.; Faust, W.; Scheiter, L.; Erb, R.; Michel, B.

Laudon, M.; Romanowicz, B.:
Technical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011. Vol.2 : Nanotechnology 2011: electronics, devices, fabrication, MEMS, fluidics and computational
Boca Raton, Fla.: CRC Press, 2011
ISBN: 1-439-87139-6
ISBN: 978-1-439-87139-3
NSTI Nanotechnology Conference and Expo <14, 2011, Boston>
Fraunhofer ENAS ()

Due to their robustness and precision, micro- and nanoelectomechanical systems (MEMS/NEMS) are frequently used for all kind of technological applications. Therefore there is a high demand regarding reliability of these components. Exact knowledge of the deformation behavior of materials, material compounds, components and constructions are the backbone of the reliability evaluation and lifetime prediction under mechanical and thermal loading. Those parameters are usually maintained by means of geometric changes at the surface, independent of the measurement method. The high-resolution computer tomography enables the non-destructive acquisition of loading-dependent variations in the 3D-volume of objects, which can be evaluated quantitative and qualitative by using new developed software.