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FEM simulation and its application in MEMS design

: Jia, C.; Reuter, D.; Wen, Z.; Baum, M.; Wiemer, M.; Gessner, T.


Institute of Electrical and Electronics Engineers -IEEE-:
SCD 2011, IEEE Semiconductor Conference Dresden. Technology, Design, Packaging, Simulation and Test. CD-ROM : 27-28 Sept. 2011, Dresden, International Conference, Workshop and Table-top Exhibition
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0431-4
ISBN: 978-1-4577-0430-7
ISBN: 978-1-4577-0429-1
Art. 6068759
Semiconductor Conference <2011, Dresden>
Fraunhofer ENAS ()

This paper presents the simulated static and dynamic properties of a micro capacitive transducer by using commercial FEM software - ANSYS. Evaluation of the stress distribution in the stretched membrane of the transducer indicates that the location of the access holes plays an important role for reliable device fabrication and operation. Acoustic simulation shows that the pressure variation in the radiation field of a piston source can be explicitly demonstrated. Experiment results validate the effectiveness of FEM simulation as a useful tool for the design of MEMS devices and rough estimation of their properties.