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20% efficient screen-printed and aluminum-alloyed back-contact back-junction cells and interconnection scheme of point-shaped metalized cells

: Woehl, R.; Keding, R.; Rüdiger, M.; Gentischer, H.; Clement, F.; Wilde, J.; Biro, D.

Postprint urn:nbn:de:0011-n-2089049 (795 KByte PDF)
MD5 Fingerprint: 3d6b55bd6e4973d7278973a6bfe4ee01
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Erstellt am: 3.8.2012

IEEE Electron Devices Society:
37th IEEE Photovoltaic Specialists Conference, PVSC 2011 : 19-24 June 2011, Seattle, WA, USA
Piscataway: IEEE, 2011
ISBN: 978-1-4244-9966-3
ISBN: 978-1-4244-9965-6 (print)
Photovoltaic Specialists Conference (PVSC) <37, 2011, Seattle/Wash.>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
PV Produktionstechnologie und Qualitätssicherung; Silicium-Photovoltaik; Oberflächen - Konditionierung; Passivierung; Lichteinfang; Kontaktierung und Strukturierung; Herstellung und Analyse von hocheffizienten Solarzellen; Industrielle und neuartige Solarzellenstrukturen

A back-contact back-junction silicon solar cell is presented that was exclusively structured and metalized by screen-printing technology. On n-type base material the emitter was formed by locally printed and alloyed aluminum structures in a co-firing process. By a varying emitter coverage on the rear the influence on the collection probability and thus the short-circuit current density is analyzed by light beam induced current (LBIC) measurements. Efficiencies of up to 20% were realized and independently confirmed by Fraunhofer ISE CalLab. Two-dimensional simulations of the cell structure are performed and agree well with the processed cell. Variations of several parameters show room for further efficiency increase. Furthermore a new module concept for back-contact cells is presented where the metallization on cell level is point-shaped. The lateral conductance of collected carriers is enabled on module level by a structured printed circuit board. On the contacts an adh esive agent is screen-printed in order to make the aluminum contacts solderable. Afterwards a soldering paste is screen-printed which connects the cell and the printed circuit board or foil during a reflow process. This concept overcomes the restriction in cell size of back-contact back-junction modules due to thick copper layer.