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3D RFID transponder antennas for smart packaging applications

: Zichner, R.; Baumann, R.R.

Society for Imaging Science and Technology -IS&T-:
Digital Fabrication 2011. NIP 27, 27th International Conference on Digital Printing Technologies. Technical programs and proceedings : October 2 - 6, 2011, Minneapolis, Minnesota; 7th International Conference on Digital Fabrication
Springfield/Va.: IS&T, 2011
ISBN: 978-0-89208-296-4
International Conference on Digital Printing Technologies (NIP) <27, 2011, Minneapolis/Minn.>
International Conference on Digital Fabrication <7, 2011, Minneapolis/Minn.>
Fraunhofer ENAS ()

During the recent years we observe a growing number of smart packaging applications. Within this field radio frequency identification (RFID) technology contributes remarkably to the progress by providing the matching communication / data transmission opportunities. In order to employ RFID technology for packaging applications the availability of highly functional RFID transponders (antenna + silicon chip) is necessary, which satisfy a maximum of communication reliability and reading distance. We report on a significant improvement of the performance of existing transponder systems by the introduction of three dimensional (3D) antennas which can be printed cost efficient directly on the planar packaging material and become three dimensional in the folding step of erecting a cardboard box. These 3D antennas for different frequency ranges, each particularly designed regarding layout and dimensions of the package and its content open a wide range of reliable packaging appli cations and therefore contribute remarkably to the development of the "internet of things ".