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Packaging and characterisation of ultra low power VCSEL for sensor networks

: Sohr, S.; Fischer, D.; Rieske, R.; Nieweglowski, K.; Wolter, K.-J.


2011 International Students and Young Scientists Workshop "Photonics and Microsystems", STYSW 2011 : 8-10 July 2011, Cottbus, Germany
Piscataway: IEEE, 2011
ISBN: 978-1-4577-1652-2
ISBN: 978-1-4577-1651-5
International Students and Young Scientists Workshop "Photonics and Microsystems" (STYSW) <2011, Cottbus>
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

In this paper an ultra-low power VCSEL with an electrical consumption of below 5 mW is characterised to electrical power, optical power, temperature as well as a spectral investigation. First the pigtail manufacture is described, where amongst others the VCSEL is bonded on a ceramic carrier and connected to an optical fibre by front surface coupling. Thereby the fibre-chip coupling is realised by using index matching adhesive as well as active alignment. Finally the results of the characterisation are analysed to find optimal operation conditions. For comparison results of a common VCSEL are shown.