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Effective thermophysical properties of thermal inferface materials. Part I definitions and models

: Savija, I.; Culham, J.R.; Yovanovich, M.M.

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division:
Advances in electronic packaging 2003. Vol.2 : Presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6 - 11, 2003, Maui, Hawaii. InterPACK '03, IPACK 03
New York, NY: ASME, 2003
ISBN: 0-7918-3691-6
International Electronic Packaging Technical Conference and Exhibition <2002, Maui/Hawaii>
Fraunhofer IISB ()
thermal interface materials (TIMs); thermal joint; contact resistance; thermal conductivity; Young's modulus; in situ thickness; Bulk Resistance Method (BRM); ASTM D 5470

The conductivity of thermal interface materials are typically determined using procedures detailed in AS MD 5470.he disadvantages of using these existing procedures for compliant materials are discussed along with a proposed new procedure for determining thermal conductivity and Youngs modulus. The new proce dure,denoted as the Bulk Resistance Method,is based on experimentally determined thermal resistance data and an analytical model for thermal resistance in joints incorporating thermal interface materials.wo versions of the model are presented,the Simple Bulk Resistance Model,based on the interface material thickness prior to loading and a more precise version denoted as the General Bulk Resistance Model,that includes additional parameters such as surface characteristics and thermophysical properties of the contacting solids.Both methods can be used to predict material in situ thickness as a function of load.