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Effective thermophysical properties of thermal interface materials: Part II experiments and data

: Savija, I.; Culham, J.R.; Yovanovich, M.M.

American Society of Mechanical Engineers -ASME-, Electronic and Photonic Packaging Division:
Advances in electronic packaging 2003. Vol.2 : Presented at 2003 International Electronic Packaging Technical Conference and Exhibition, July 6 - 11, 2003, Maui, Hawaii. InterPACK '03, IPACK 03
New York, NY: ASME, 2003
ISBN: 0-7918-3691-6
International Electronic Packaging Technical Conference and Exhibition <2002, Maui/Hawaii>
Fraunhofer IISB ()
thermal interface materials (TIMs); thermal joint; contact resistance; thermal conductivity; Young's modulus; in situ thickness; Bulk Resistance Method (BRM); test apparatus; GrafoilGTA data

A new method for determining effective thermal conductivity and Youngs modulus in thermal interface materials is demonstrated.The method denoted as the Bulk Resistance Method (BRM)uses empircal thermal resistance data and analytical modeling to accurately predict thermophysical properties that account for in-situ changes in material thickness due to external loading and thermal expansion. The BRM is demonstrated using commercially available sheets of Graf oil GTA 1 .ests were performed on thermal joints consisting of two Al 2024 machined surfaces with layers of Grafoil GA in the interface. est conditions included a vacuum environment,0.2-6.5 MPa contact pressure,a nominal 50 oC mean interface temperature and a continuous loading and unloading cycle. Test results indicated that the BRM consistently predicted thermal conductivity indep endent of the number of layers tested and that the predicted results were significantly lower than values reported using conventional ASTM test procedures.