Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds

: Merkle, L.; Sonner, M.; Petzold, M.

Preprint urn:nbn:de:0011-n-2066925 (1.0 MByte PDF)
MD5 Fingerprint: 80cb2d7884271d77e023d4d6bc687c55
Erstellt am: 22.11.2013

Soldering & surface mount technology 24 (2012), Nr.2, S.127-134
ISSN: 0954-0911
Zeitschriftenaufsatz, Elektronische Publikation
Fraunhofer IWM ()
wires; fatigue (materials); durability; simulation; heavy wire bonds; finite element method; bond parameter; nanoindentation; bond heel lifetime; solder joint; reliability

Purpose - The purpose of this paper is to establish a law on the durability of thick aluminium wire bonds in low cycle fatigue for different geometries and wire diameters under a purely mechanical load. Design/methodology/approach - Bond wires with different geometries were tested with various loads and a mechanical test bench, and their endurance was determined. The same load situation was modelled with finite element analysis and then compared against the experimental results. Findings - A correlation was found between the plastic strain per cycle and the determined lifespan. Therefore, the lifespan can be calculated by mechanical-plastic simulation for various loop geometries and loading cases. Practical implications - The loop height strongly influences the durability of the wire bond, whereas other parameters, such as the loop angle, have a weaker influence on the bond heel lifetime. Originality/value - The mechanical simulation is able to replace the time-consumin g lifetime experiments.