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Emerging techniques for 3-D integrated system-in-package failure diagnostics

: Altmann, F.; Petzold, M.

Preprint urn:nbn:de:0011-n-2066074 (3.5 MByte PDF)
MD5 Fingerprint: e4eac25e986b8adf8aff2917db3b5787
Erstellt am: 13.11.2013

Electronic device failure analysis : EDFAS 14 (2012), Nr.2, S.14-20
ISSN: 1537-0755
Zeitschriftenaufsatz, Elektronische Publikation
Fraunhofer IWM ()
emerging techniques; scanning acoustic microscopy; 3-D SiP; SEM analysis; FIB; lock-in thermography; laser ablation process; combined FIB-SEM systems

Newly developed techniques suitable and adapted to the needs of physical failure analysis of highly integrated 3-D SiP (System-in-Package) devices are reviewed. Scanning acoustic microscopy (SAM) is a powerful tool for nondestructive investigation of internal structures in optically opaque materials and typically provides a spatial resolution on the order of >10 m. Lock-in thermography (LIT) is a novel technique for thermally based fault isolation to identify electrical defects such as resistive opens and electrical shorts. Combined FIB-SEM systems are widely used for physical failure analysis of CMOS devices because the FIB allows site-specific sample preparation, and the SEM analysis provides structural and chemical information with submicron resolution. An alternative approach for both precise and time-efficient cross sectioning is the combination of FIB with a preceding laser ablation process.