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Combined creep and fatigue measurement method for lead-free solder alloys

 
: Metasch, R.; Roellig, M.; Wolter, K.-J.

:

Institute of Electrical and Electronics Engineers -IEEE-:
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : 16 - 18 April 2012, Cascais, Portugal
Piscataway: IEEE, 2012
ISBN: 978-1-4673-1512-8
ISBN: 978-1-4673-1513-5
S.243-249
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
This work studies the secondary creep behaviour at approx. 25 % stress drop in the fatigue curve on bulk solder specimens in a tensile and compression experiment. With the adaption of the pre - factor of the secondary creep models the acceleration is describable. To get a good correlation between the model as well as the real tensile and compression experiments, advanced modelling with primary and tertiary creep will be necessary.

: http://publica.fraunhofer.de/dokumente/N-206448.html