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Lifetime assessment of BGA solder joints with voids under thermo-mechanical load

 
: Schwerz, R.; Roellig, M.; Meier, K.; Wolter, K.-J.

:

Institute of Electrical and Electronics Engineers -IEEE-:
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2012 : 16 - 18 April 2012, Cascais, Portugal
Piscataway: IEEE, 2012
ISBN: 978-1-4673-1512-8
ISBN: 978-1-4673-1513-5
S.373-379
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <13, 2012, Cascais>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
This study examines the reliability of solder joints with voids under thermo mechanical loading. Nondestructive and destructive failure analysis has been done to inspect the presence and distribution of voids in a BGA component with 100 IO connections. Characteristic voiding scenarios have been created and implemented in a three dimensional finite-element model representing the component. The results of the nonlinear finite element analysis (FEA) are compared to the experimental thermal cycling results. A refined model including a critical joint of the package is then used to focus on the influence of voids. It will be shown that voids can increase a joint's reliability, have negligible impact or heavily reduce the lifetime all depending on the location and size within the solder volume.

: http://publica.fraunhofer.de/dokumente/N-206442.html