Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
Date Issued
2004
Author(s)
Jakob, A.
Vissing, K.-D.
Stenzel, V.
Patent No
2002156247
2003153530
Abstract
The invention relates to a method and a device for machining wafers, in particular for thinning wafers. The invention also relates to a wafer comprising a support layer and a separation layer that is situated between the support layer and the wafer. Said separation layer is a plasma polymer layer, which adheres to the wafer and adheres to the support layer more strongly than to the wafer.