Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Thermal ALD of Cu via reduction of CuxO films for the advanced metallization in spintronic and ULSI interconnect systems
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Mueller, S.; Waechtler, T.; Tuchscherer, A.; Mothes, R.; Gordan, O.; Lehmann, D.; Haidu, F.; Ogiewa, M.; Gerlich, L.; Ding, S.-F.; Schulz, S.E.; Gessner, T.; Lang, H.; Zahn, D.R.T.; Qu, X.-P. | Institute of Electrical and Electronics Engineers -IEEE-:
SCD 2011, IEEE Semiconductor Conference Dresden. Technology, Design, Packaging, Simulation and Test. CD-ROM : 27-28 Sept. 2011, Dresden, International Conference, Workshop and Table-top Exhibition
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0431-4
ISBN: 978-1-4577-0430-7
ISBN: 978-1-4577-0429-1
4 S. |
| Semiconductor Conference <2011, Dresden> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer ENAS () |