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Developement trends in the field of wafer bonding technologies
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2011
Conference Paper
Titel
Developement trends in the field of wafer bonding technologies
Author(s)
Wiemer, Maik
Braeuer, J.
Besser, J.
Wünsch, Dirk
Hauptwerk
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts
Konferenz
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) 2011
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS