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Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems
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2011
Conference Paper
Titel
Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems
Author(s)
Braeuer, J.
Besser, J.
Wiemer, Maik
Geßner, Thomas
Hauptwerk
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts
Konferenz
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) 2011
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS