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Room-temperature reactive bonding: An overview of integrated nano scale multilayer systems

 
: Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.

Knechtel, R.:
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 6th - 8th December 2011, Chemnitz, Germany
Chemnitz: Fraunhofer ENAS, 2011
S.79-80
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2011, Chemnitz>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/dokumente/N-198866.html