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Aluminum-germanium wafer bonding of (AlGaIn)N thin film light-emitting diodes

 
: Gossler, C.; Kunzer, M.; Baum, M.; Wiemer, M.; Moser, R.; Passow, T.; Koehler, K.; Schwarz, U.T.; Wagner, J.

Knechtel, R.:
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 6th - 8th December 2011, Chemnitz, Germany
Chemnitz: Fraunhofer ENAS, 2011
S.23 ff
Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2011, Chemnitz>
Englisch
Abstract
Fraunhofer ENAS ()

: http://publica.fraunhofer.de/dokumente/N-198837.html