Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. New generation of electrostatic carrier technology (T-ESC) for reversible thin wafer clamping with seal glass bonding
| Knechtel, R.:
WaferBond 2011, Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. Book of Abstracts : 6th - 8th December 2011, Chemnitz, Germany
Chemnitz: Fraunhofer ENAS, 2011
S.111 |
| Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) <2011, Chemnitz> |
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| Englisch |
| Abstract |
| Fraunhofer ENAS () |