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New packaging and interconnect technologies for ultra thin chips

: Kallmayer, C.; Aschenbrenner, R.; Haberland, J.; Reichl, H.

Surface Mount Technology Association -SMTA-:
Pan Pacific Microelectronics Symposium and Tabletop Exhibition 2010 : Kauai, Hawaii, 26 - 28 January 2010
Red Hook, NY: Curran, 2010
ISBN: 978-1-615-67947-8
Pan Pacific Microelectronics Symposium <2010, Kauai/Hawaii>
Fraunhofer IZM ()

This paper shows different approaches to use the availability of ultrathin chips for the realization of new packages with high density and improved performance. For several years technologies have been developed for the embedding of chips in circuit boards in order to achieve 3-D-packages using conventional processes from PCB manufacturing. Ultrathin chips are suited to be integrated in rigid circuit boards as well as on and in multilayer flexible substrates. The use of interposers prior to embedding can facilitate the embedding of components with ultra fine pitches. An example for a complex RFID-based product will be shown which is enabled by the integration of ultrathin dies.