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ZR-based metallic glass as a novel MEMS bonding material

 
: Lin, Y.-C.; Froemel, J.; Sharma, P.; Inoue, A.; Esashi, M.; Gessner, T.

:

Institute of Electrical and Electronics Engineers -IEEE-; IEEE Robotics and Automation Society:
IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011. Vol.1 : Cancun, Mexico, 23 - 27 January 2011
Piscataway/NJ: IEEE, 2011
ISBN: 978-1-4244-9632-7
ISBN: 978-1-4244-9634-1
S.509-512
International Conference on Micro Electro Mechanical Systems (MEMS) <24, 2011, Cancun>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
In this study, for the first time we successfully bonded Si substrates with sputtered Zr-Al-Cu-Ni metallic glassy material. The surface pre-treatment with formic acid vapor plays a remarkable function for oxides removal before bonding. Metallic glasses have fundamentally glassy structure and exhibit a Newtonian viscous flow in the supercooled liquid region. The polymer-like plastic fluidity performs superior wettability which improves interfacial integrity. This paper introduces a unique functional material and reveals its high potential for MEMS bonding application.

: http://publica.fraunhofer.de/dokumente/N-190019.html