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Life time prediction for lead-free solder joints under vibration loads

: Meier, K.; Röllig, M.; Schiessl, A.; Wolter, K.-J.


Institute of Electrical and Electronics Engineers -IEEE-:
12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 : Linz, Austria, 18 - 20 April 2011
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0107-8
ISBN: 978-1-4577-0106-1
International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <12, 2011, Linz>
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

In this work the life time of solder joints of SMD components is studied under vibration loading. This kind of purely mechanical load is one of the main failure causes in automotive electronics. A test vehicle has been designed to enable vibration testing on SMD capacitors (size 0805). The test vehicle is distinguished with a line clamping and stripe shape which both leads to a concerted loading of the component solder joints. The test vehicles were analysed for their resonant frequency prior test and loaded with a sinusoidal vibration close to the resonant frequency for certain numbers of cycles. The loading of the individual components was measured using a vibrometer. Components were stressed with wave amplitudes from 0.3 mm up to 0.8 mm and normalised cycle counts from 1 up to 12. All tests were accomplished at room temperature. Cross sectioning was performed to evaluate damage location within and cracking of the solder joints. The observed damage location clearly di ffers to results from temperature cycling tests. Cracking of the intermetallic interface was not observed. Cracks propagated in the solder bulk. This enables a solder fatigue model since no interface effect is involved in the damage process.