PublicaHier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.
Glass panel processing for electrical and optical packaging
|IEEE Components, Packaging, and Manufacturing Technology Society:|
IEEE 61st Electronic Components and Technology Conference, ECTC 2011 : Lake Buena Vista, Florida, USA, 31 May - 3 June 2011; 2011 proceedings
Piscataway/NJ: IEEE, 2011
ISBN: 978-1-61284-497-8 (Print)
|Electronic Components and Technology Conference (ECTC) <61, 2011, Lake Buena Vista/Fla.>|
|Fraunhofer IZM ()|
Glass is a perfect substrate material for electrical and optical packaging. The integration concept to bridge board and chip level using thin glass substrates by lamination in between of PCB base material will be presented. Different thin glasses are commercial available and will be reviewed. Furthermore the paper reviews glass panel processing in the area of display and electro/optical packaging focusing on integration advantages for photonic packaging. Ion exchange technology for large panel processing to integrate high-performing optical waveguides will be demonstrated for multi-mode beam propagation. Based on glass based photonic system-in-package (SiP) which is done on wafer level the up scaling on panel size of those processes is discussed in detail and experimental results are presented.