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Anodically-bondable LTCC substrates with novel nano-structured electrical interconnection for MEMS packaging

: Lin, Y.-C.; Wang, W.-S.; Chen, L.Y.; Chen, M.W.; Gessner, T.; Esashi, M.


Institute of Electrical and Electronics Engineers -IEEE-:
16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2011 : 5-9 June 2011, Beijing
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0157-3
ISBN: 978-1-4577-0156-6
International Solid-State Sensors, Actuators and Microsystems Conference <16, 2011, Beijing>
Fraunhofer ENAS ()

In this study, anodically-bondable LTCC (low temperature cofired ceramic) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. On-chip MEMS compatible fabrication of nanoporous gold (NPG) was developed and its porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. A MEMS integrated Si substrate is mechanically sealed to a metal feedthrough LTCC substrate by anodic bonding and its electrical connection is formed by the nanoporous structured pads simultaneously.