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Reliability of insulating substrates - high temperature power electronics for more electric aircraft

: Schletz, A.; Nomann, M.; Rauch, M.; Kraft, S.; Egelkraut, S.

Institute of Electrical and Electronics Engineers -IEEE-:
14th European Conference on Power Electronis and Applications, EPE 2011. Proceedings : Aug. 30 - Sep 1, 2011, Birmingham
New York, NY: IEEE, 2011
ISBN: 978-1-61284-167-0 (Print)
ISBN: 978-90-75815-15-3 (Online)
7 S.
European Conference on Power Electronis and Applications (EPE) <14, 2011, Birmingham>
Fraunhofer IIS ()

Insulating substrates for high temperature power electronics are in the focus of this paper. The targets were 200°C ambient temperature (base plate) and 300°C junction temperature for the use of silicon carbide devices. DBA and DBC were tested if they are suitable to reach this target. A comparative temperature cycling test under extreme conditions was done. Standard DBC substrates with alumina ceramic withstand only a few cycles. The first idea that higher mean temperatures will increase the temperature cycling capability could not be confirmed. DBA substrates have a very high temperature cycling capability, more than one order of magnitude higher compared to standard DBC. There is a totally different failure mechanism. The surface get rough. There was no optical influence on the die attach quality.