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Novel test structures for hermetictiy testing of wafer bonding technologies

: Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.


Colinge, C. ; Electrochemical Society -ECS-:
Semiconductor Wafer Bonding 11. Science, Technology, and Applications : In honor of Ulrich Gösele; Presented in the symposium entitled "Semiconductor Wafer Bonding 11: Science, Technology, and Applications - in Honor of Ulrich Gösele" held during the 218th meeting of the Electrochemical Society, in Las Vegas, Nevada from October 10 to 15, 2010
Pennington, NJ: ECS, 2010 (ECS transactions 33.2010, Nr.4)
ISBN: 978-1-566-77823-7
ISBN: 978-1-60768-173-1
ISSN: 1938-5862
International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications <11, 2010, Las Vegas/Nev.>
Electrochemical Society (Meeting) <218, 2010, Las Vegas/Nev.>
Fraunhofer IZM ()

Many Micro-Electro-Mechanical System (MEMS) devices such as gyroscopes, accelerometers, infrared uncooled arrays, radio frequency (RF) resonators etc. require vacuum packaging. In this paper novel MEMS resonators designed as double ended tuning forks (DETF) with pressure sensitive quality factor are presented. The study of different DETF-designs clearly identified the strucutres' ability to monitor the inside cavity pressure of hermetically sealed micro packages. Therefore a new test vehicle for the development and long-time reliability of hermetic wafer bonding technologies can be provided.