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2010
Conference Paper
Titel
fibDAC stress relief - A novel stress measurement approach for BEoL structures
Abstract
fibDAC stress relief is a new method developed to measure stresses on micro and nanotechnology devices. Focused Ion Beam (FIB) milling is used to remove locally material and release this way stresses. Cross correlation algorithms on high resolution SEM images captured before and after ion milling reveal stress relief deformations. Their analysis allows computation of stresses present at the place of ion milling. Thorough qualification of the approach resulted in a stress measurement accuracy of 1-510-4E, where E is the Young's modulus of the material tested. Lateral resolution of stresses can be reduced to a value around 200 ... 500 nm.