Publica
Hier finden Sie wissenschaftliche Publikationen aus den FraunhoferInstituten. Fast integral equation solution techniques for planar3D structures in multilayered media
 Electromagnetics Academy, Cambridge/Mass.: PIERS 2010, Progress in Electromagnetics Research Symposium. Proceedings : March July 58, 2010, Cambridge, USA Cambridge/Mass.: Electromagnetics Academy, 2010 ISBN: 9781934142141 S.115120 
 Progress in Electromagnetics Research Symposium (PIERS) <2010, Cambridge/Mass.> 

 Englisch 
 Konferenzbeitrag, Elektronische Publikation 
 Fraunhofer FHR 
Abstract
In this contribution, a hybrid space/spectral domain integral equation approach is presented for the characterization of quasi3D structures in multilayered media. The vertical conductors for the quasi3D components like vias, through holes, airbridges, finite dielectric regions etc. can cross an arbitrary number of dielectric layers with arbitrary vertical discretization. The electrodynamic behavior of the vertical currents is incorporated by extended spectral domain Green's functions derived by analytical integrations over the vertical direction and by a summation over the Cartesian wavenumbers which must be computed only once and stored in a database. For short lateral distances, the couplings are computed with a subtraction technique based on asymptotic representations of the extended Green's functions, whereas for larger distances and for group coupling computations in context with fast matrix vector product evaluations, adaptive integration path deformations with extended Laguerre quadrature methods are applied. For the solution of the linear systems of equations, a GMRES solver was implemented together with a diakoptic preconditioner based on the group decomposition of larger structures, combined with a reversed Cuthill McKee reordering applied to the submatrix pattern of the system matrix. With all these techniques, the analysis of complex quasi3D structures can be carried out with the same performance than pure planar microstrip and/or slotline structures.