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Hermeticity of eutectic bond layers for sensor packages on wafer-level

: Schneider, A.; Rank, H.; Müller-Fiedler, R.; Wittler, O.; Reichl, H.


Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.1 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
Fraunhofer IZM ()

In MEMS industry there is a high demand for reliable hermetic wafer-level encapsulation. This paper presents a methodology to monitor the pressure inside a package after the wafer-level bonding process. Therefore, novel micro-electro-mechanical resonators designed as double ended tuning forks (DETFs) were built to measure the quality factor Q as a function of the inside cavity pressure. Obtained experimental results clearly verified the feasibility of the developed MEMS structures, providing a simple method to evaluate the hermeticity of wafer bonding technologies.