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Packaging for radiation resistant X-ray detectors

 
: Lohse, T.; Oppermann, M.; Metasch, R.; Zerna, T.; Seilmayer, M.; Wolter, K.

:

Nicolics, J. ; IEEE Components, Packaging, and Manufacturing Technology Society:
33rd International Spring Seminar on Electronics Technology, ISSE 2010: Polymer Electronics and Nanotechnologies: Towards System Integration : Warsaw, Poland, 12 - 16 May 2010; conference proceedings
Piscataway: IEEE, 2010
ISBN: 978-1-4244-7850-7
ISBN: 978-1-4244-7849-1
S.138-142
International Spring Seminar on Electronics Technology (ISSE) <33, 2010, Warsaw>
Englisch
Konferenzbeitrag
Fraunhofer IZFP ()

Abstract
Today non-destructive evaluation techniques become more and more important. Consequently, X-ray detectors are suitable tools to get information about specimens. In comparison to the already established scintillation principle, the direct converting method on the basis of semiconductor materials delivers several advantages. Hence, it is necessary to speed this measurement method and develop appropriate packages for these assemblies. In this paper the method of direct converting X-ray line detectors as well as their packaging and relevant aspects are introduced.

: http://publica.fraunhofer.de/dokumente/N-186424.html