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On the Numerical Analysis of Microwave Processes in Microsystems Packaging Applications

 
: Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Müller, Guido; Adamietz, Raphael; Bailey, Chris; Desmulliez, Marc P.Y.

Khalili, Nasser ; Australian Association for Computational Mechanics; Asian Pacific Association for Computational Mechanics; International Association for Computational Mechanics:
9th World Congress on Computational Mechanics and 4th Asian Pacific Congress on Computational Mechanics 2010. Proceedings. CD-ROM : 19-23 July 2010, Sydney, Australia. Full length papers
Bristol: IOP Publishing, 2010 (IOP conference series. Materials science and engineering 10)
2 S.
World Congress on Computational Mechanics (WCCM) <9, 2010, Sydney>
Asian Pacific Congress on Computational Mechanics (APCOM) <4, 2010, Sydney>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
Aufbautechnik; Verbindungstechnik; packaging; electronic packaging; microwave; Mikrowelle

Abstract
Electronics packaging is the process of attaching a semiconducor device to a supporting structure, such as a printed circuit board, and provision of protective materials or sturctures to the semiconductor device to enhance performance and reliability. Modern packaging technologies use polymeric materials in order to provide thermomechanical support for the device and a hermetic barrier encompassing the semiconductor. Thermosetting materials are typically used and require heat to induce or expediate the curing process. Recent studies have focused on using microwave technology to enhace the polymer cure process. Due to the complex coupled nature of the problem and the difficulty in assessing microwave curing experimentally, a numerical approach to process analysis has been adopted. This study outlines the numerical approach adopted to analyse the critical process parameters during microwave curing of microsystems packaging materials.

: http://publica.fraunhofer.de/dokumente/N-183231.html