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New manufacturing concepts for ultra-thin silicon and gallium arsenide substrates

: Bock, K.; Bleier, M.; Köthe, O.; Landesberger, C.

GaAs Mantech 2003. Proceedings
Scottsdale, Ariz., 2003
ISBN: 1-893580-04-0
International Conference on Compound Semiconductor MANufacturing TECHnology (GaAs MANTECH) <18, 2003, Scottsdale/Ariz.>
Fraunhofer IZM ()
thin wafer technology; dicing by thinning; reversible bonding technique; electrostatic carrier substrate; smart carrier

The paper reports on new manufacturing concepts for handling and processing of thin semiconductor substrates. Technologies which were formerly demonstrated for silicon wafers were recently transferred to GaAs substrates. As a result of the development work the feasibility for preparing 20 µm thin GaAs wafers showing mechanical flexibility is proven. Due to the application of dicing-by-thinning concept micro defects at the edges of ultra thin GaAs chips are practically eliminated.