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Room-temperature reactive bonding by using nano scale multilayer systems

 
: Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.

:

Institute of Electrical and Electronics Engineers -IEEE-:
16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2011 : 5-9 June 2011, Beijing
New York, NY: IEEE, 2011
ISBN: 978-1-4577-0157-3
ISBN: 978-1-4577-0156-6
S.1332-1335
International Solid-State Sensors, Actuators and Microsystems Conference <16, 2011, Beijing>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
This paper focuses on room-temperature reactive bonding by using nano scale multilayer systems. The exothermic reaction within the Ti/a-Si multilayer is used as an internal heat source for bonding. Herein, we used lithographical, wet etching and electro-plating procedures to generate very thin integrated reactive multilayer systems. The reaction in the very thin films generated enough heat to self-propagate and to melt tin films. High-speed camera imaging was used to characterize the reaction kinetics and the propagation of the reaction front onto substrates. Furthermore, we demonstrated a strong dependence on substrate material for adhesion after the reaction front has passed.

: http://publica.fraunhofer.de/dokumente/N-177586.html