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Metallisch kontaktiertes Substrat sowie Verfahren zu dessen Herstellung

Metallically contacted substrate e.g. electrically isolating substrates, has porous metallic contacting formed in surface of substrate, where partial region of contacting or whole contacting comprises matrix material
 
: Kohn, C.; Kuebler, R.; Mueller, S.

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DE 102009056308 A: 20091130
DE 102009056308 A: 20091130
H01L0023
H01L0021
H01L0031
H05K0001
Deutsch
Patent, Elektronische Publikation
Fraunhofer IWM ()

Abstract
(A1) Die vorliegende Erfindung betrifft ein metallisch kontaktiertes Substrat, bei dem mindestens eine Oberflaeche des Substrates ganz oder teilweise mit einer metallischen Kontaktierung versehen ist. Zur mechanischen Stabilisierung ist die metallische Kontaktierung mit einem Matrixmaterial versehen. Erfindungsgemaess wird ebenso ein Verfahren zur Herstellung eines derartigen Substrates angegeben.

 

DE 102009056308 A1 UPAB: 20110624 NOVELTY - The substrate (1) has a porous metallic contacting formed in a surface of the substrate, where a partial region or the whole contacting comprises matrix material (5). The contacting comprises two metals (2, 3) within two regions (I, II), respectively, where the material is hardened polymers, hardened thermoplastic and/or thermosetting material such as chemical hardened polyaddition and/or two-component adhesives i.e. epoxy resins. The contacting is made of borosilicate glass, quartz glass, soda-lime glass or plastics. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method for producing a substrate. USE - Metallically contacted substrate such as solar cells, wafers, electrically isolating substrates e.g. glass substrate, ceramic substrate, plastic substrate, thermosetting material substrate, epoxy resin substrate and printed circuit board, electrically conductive substrates and semiconductors (all claimed). Can also be used for an electronic component e.g. sensor and electronic chip. ADVANTAGE - The utilization of the matrix material improves mechanical stability and adhering of contacting at the substrate, thus reducing break rates of the substrates while preventing firmness reduction by cracking and notch effect in an effective manner.

: http://publica.fraunhofer.de/dokumente/N-174789.html