Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Numerical analysis of microwave underfill cure in ball-grid packages

 
: Tilford, Tim; Ferenets, Marju; Adamietz, Raphael; Pavuluri, Sumanth Kumar; Morris, James E.; Desmulliez, Marc P.Y.; Bailey, Chris

:

Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
S.865-870
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
Aufbautechnik; Verbindungstechnik; packaging; electronic packaging; microwave; Mikrowelle

Abstract
Microwave cure of thermosetting polymer underfill material in a simplified ball grid array package is assessed using a multiphysics analysis approach. A dual section microwave oven system capable of heating individual surface mount components on a printed circuit board assembly is described and its integration into a microelectronics manufacturing line is briefly outlined. Due to the complexity of measuring key process parameters in situ, a numerical approach, briefly described in this article, has been adopted to analyse and optimise the curing process. The numerical model comprises an unstructured finite volume thermophysical solver that is linked, through a Eulerian-Lagrangian mapping process, to a conformal finite difference time domain electromagnetic solver. A sample analysis focusing on the curing of an underfill material in a simplified ball grid array package is considered. Results obtained for a range of temperatures, microwave power density and thermomechanical stress development are presented.

: http://publica.fraunhofer.de/dokumente/N-174747.html