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Modular microwave-based system for packaging applications

 
: Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Desmulliez, Marc P.Y.; Müller, Guido; Othman, Nabih; Eicher, Frank

Japan Institute of Electronics Packaging -JIEP-; IEEE Components, Packaging, and Manufacturing Technology Society:
ICEP 2010, International Conference on Electronics Packaging. CD-ROM : May 12-14, 2010, Sapporo, Japan
Kyoto, 2010
S.325-330
International Conference on Electronics Packaging (ICEP) <2010, Sapporo>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
Aufbautechnik; Verbindungstechnik; electronic packaging; packaging; microwave; Mikrowelle

Abstract
Current industrial processes for curing of thermosetting polymer materials utilized in electronics packaging applications require the entire board assembly to be heated. An alternative approach, capable of curing individual packages on a board assembly, is described. The system consists of a small micro-engineered variable frequency microwave system which is capable of rapidly heating polymer materials. Whilst prototype systems have been shown to be able to cure packaging materials, it has not been possible to integrate the system into an industrial manufacturing line. This contribution focuses on the challenges encountered in the integration process and solutions adopted. The system implemented was based on a Sysmelec portal robot placement machine with additional tools to enable integrated pick, place and dispense capability. The completed system was demonstrated to be able to conduct fully automated pick - place- dispense - cure operations. Tests on curing encapsulant materials dispensed over a commerically available QFN were performed to detemine post-process functionality of the package, with no detrimental effects evident.

: http://publica.fraunhofer.de/dokumente/N-174745.html