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2010
Conference Paper
Titel
A novel in-situ force measurement method for real solder joints fatigue
Abstract
The paper presents a novel approach to measure shear forces at solder joints during temp. cycle loadings. Due to plastic deformation inside the solder joints during the temp. cycles the solder-material-matrix continuously damages until micro cracks occur. This degrdn. behavior is tracked by direct force measurement under thermal cycling loads using an Aluminum-Copper-loading frame. After the overall characterization of the fatigue machine by expt. and FE-Simulation, first successful results were generated based on 400μm solder balls on micro CSP-package stressed under -40°C and +125°C conditions. A force drop down to approx. 60% of initial force at the first cycles was measured. The measured forces kept in a steady state ranged over approx. 80% of lifetime until the material mech. failed.
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