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Rapid prototyping of electronic modules combining aerosol printing and ink jet printing

 
: Gieser, H.A.; Bonfert, D.; Hengelmann, H.; Wolf, H.; Bock, K.; Zollmer, V.; Werner, C.; Domann, G.; Bahr, J.; Ndip, I.; Curran, B.; Oehler, F.; Milosiu, H.

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Institute of Electrical and Electronics Engineers -IEEE-; VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik -GMM-:
3rd Electronics System Integration Technology Conference, ESTC 2010. Proceedings. Vol.2 : Berlin, Germany, 13 - 16 September 2010
New York, NY: IEEE, 2010
ISBN: 978-1-4244-8553-6
ISBN: 978-1-4244-8554-3
S.624-629
Electronics System Integration Technology Conference (ESTC) <3, 2010, Berlin>
Englisch
Konferenzbeitrag
Fraunhofer IZM-M

Abstract
Maskless direct printing is a good candidate for rapid prototyping and even emerging for manufacturing of large scale electronics. Aiming for rapid prototyping of small multi-layer modules the study combines Aerosol Jet® printing and ink jet printing. Conductive silver traces own to 20 m width were printed together with large mterconnect areas on isolating layers of inorganic-organic hybrid polymer (ORMOCER®) and on glass substrates. New copper nickel inks and high-k ORMOCER®s filled with barium titanate particles are paving a path to integrated printed resistors and capacitors. Although some issues still need to be resolved for a commercial grade process the detail solutions presented for the first time and the active integrated circuits and devices attached to the same substrate demonstrate a path and the principle technical feasibility of this method for heterogeneous integration.

: http://publica.fraunhofer.de/dokumente/N-173193.html