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2002
Conference Paper
Titel
Modular systems for sensor integration
Abstract
A concept for the integration of sensors was developed. Prototypes were built up applying conventional stencil printing and pick and place equipment. The feasibility to manufacture the modular FR-4 package was demonstrated in phase 1 and reliability tests did not reveal significant degradation of the measured resistance values. The experiments conducted during phase 2 proved the feasibility to assemble chips with 300 m pitch using COB or FC technology, respectively.