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Chip in polymer - Next step in miniaturization

: Ostmann, A.; Neumann, A.; Jung, E.; Boettcher, L.; Reichl, H.

Advancing microelectronics 29 (2002), Nr.3
ISSN: 2222-8748
Fraunhofer IZM ()

A new packaging concept, chip in polymer (CIP), technology has been developed at the Technical University of Berlin (TUB) to solve the packaging and miniaturization problems. It is found that much shorter and impedance-matched interconnects between chips and passive components are required to maintain signal integrity. The CIP technology is based on the embedding of thin chips into the build-up layers of a printed circuit board (PCB). Further development aims for ultra-dense and high frequency applications manufactured by cost effective processes.