Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Packaging of an electronic-microfluidic hybrid sensor

: Jung, E.; Assmann, R.; Aschenbrenner, R.; Reichl, H.

IEEE Components, Packaging, and Manufacturing Technology Society; Electronic Industries Alliance -EIA-; Electronic Components, Assemblies, and Materials Association:
53rd Electronic Components & Technology Conference 2003. Proceedings : New Orleans, Louisiana, USA, May 27 - 30, 2003
Piscataway, NJ: IEEE Service Center, 2003
ISBN: 0-7803-7791-5
Electronic Components and Technology Conference (ECTC) <53, 2003, New Orleans/La.>
Fraunhofer IZM ()

Biotechnology and microelectronics have begun to merge to form an alliance in battling diseases, analyzing hazardous ambients and much more. Crucial for this was the development of microfluidic components and respective microelectronic based sensors. As mass manufacturing allows to bring the research results from the lab to the market, solutions to merge the two disciplines in a cost effective, performance oriented way are needed. Packaging can play a crucial role here, as a seamless integation of microfluidics and microelectronics paves the way to commercially attractive products. The paper describes the development of a packaging strategy for the seamless integration of a microfluidic structured carrier and a sensor chip in a prototype package that can easily be upscaled to production. The concept, the applied technologies and dimensioning will be described.