Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Manufacturing Issues for 3D Integrated Active Circuits into Organic Laminate Substrates

: Jung, E.; Wojakowski, D.; Neumann, A.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.

Harvey, P. ; Institute of Electrical and Electronics Engineers -IEEE-; Components, Packaging and Manufacturing Technology Society -CPMT-; Semiconductor Equipment and Materials International -SEMI-, San Jose/Calif.:
IEEE/CPMT/SEMI 28th International Electronics Manufacturing Technology Symposium 2003. CD-ROM : July 16 - 18, 2003, the Marriott Hotel, San Jose, CA, USA. Proceedings
Piscataway, NJ: IEEE, 2003
ISBN: 0-7803-7934-9
International Electronics Manufacturing Technology Symposium (IEMT) <28, 2003, San Jose/Calif.>
Fraunhofer IZM ()

The three dimensional integration of active circuits, thinned or in standard thickness, into polymeric substrates challenges current substrate manufacturing processes in an unprecedented way. In order to overcome the risks associated with this 3D integration technology, the issues must be carefully studied and assessed. For the direct integration of ultrathin chips into dielectric build up layers of multi-layer printed circuit boards, such issues were identified and put to the test using advanced pcb manufacturing methods. Among the risks encountered in a manufacturing ambient Material selection linear tolerance on a 18×12" board placement of ultrathin dice lamination process laser/plasma via formation electroless deposition of seed layer patterning of the contact structures testing voltages were observed to be the ones affecting the outcome and will be discussed.