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Environmental management in semiconductor and printed circuit board industry in India - Part II: Benchmarking and international best practice sharing

: Schischke, K.; Pandey, U.C.; Sethi, V.C.; Griese, H.; Reichl, H.

IEEE Components, Packaging, and Manufacturing Technology Society:
International IEEE Conference on the Asian Green Electronics, AGEC 2004. Proceedings : January 5 - 6, City University of Hong Kong, China, January 7 - 9, 2004, Mission Hills Resort, Shenzhen, China
Piscataway, NJ: IEEE, 2004
ISBN: 0-7803-8203-X
International Conference on Asian Green Electronics (AGEC) <2004, Hong Kong>
Fraunhofer IZM ()

Part II of the paper on "Environmental Management in Semiconductor and Printed Circuit Board Industry in India" sets the focus on benchmarking of the survey results and international best practice sharing. Environmental issues have got different priorities in different regions of the world. Also the general framework for the economy, open-mindedness for an appropriate environmental management and the approaches necessary to tackle environmental problems are specific for different regions. The part II paper compares the different background of Europe and India for implementing environmental management. The intermediary results of the DIT project are set in a global context through a benchmark analysis based on research and development activities of Fraunhofer IZM with European electronics industry, The importance of international know-how exchange to learn from each others technological and environmental expertise is shown.