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A novel modeling approach for multiple coupled wire bond interconnects

: Doerr, I.; Sommer, G.; Reichl, H.

8th IEEE Workshop on Signal Propagation on Interconnects. Proceedings : 9 - 12 May 2004, Heidelberg
Piscataway, NJ: IEEE Service Center, 2004
ISBN: 0-7803-8470-9
Workshop on Signal Propagation on Interconnects <8, 2004, Heidelberg>
Fraunhofer IZM ()

A novel approach for electrical modeling of multiple coupled wire bonds up to a frequency of 10GHz is presented. This paper describes a very easy way to get complex electrical model for complex structures like multiple coupled wire bonds. Electromagnetic field computation and compact model extraction using optimization algorithm is limited on few elements. A very efficient way is starting with the development of an equivalent circuit model for a single wire bond. The electrical model of single interconnect is used to model coupled interconnects. Full wave electromagnetic field computation was used to calculate the S-parameters. Sparameters are very good suitable to extract compact models for radio frequencies (RF). Moreover, this procedure is still more effectively by using parameterized models for design kits and libraries.