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Design methodology of microstructures for enhanced mechanical reliability

: Wittler, O.; Walter, H.; Vogel, D.; Keller, J.; Michel, B.


Quan, C. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Third International Conference on Experimental Mechanics and Third Conference of the Asian Committee on Experimental Mechanics. Part I : 29 November - 1 December 2004, Singapore
Bellingham, WA: SPIE, 2005 (Proceedings of SPIE 5852)
ISBN: 0-8194-5852-X
International Conference on Experimental Mechanics <3, 2004, Singapore>
Fraunhofer IZM ()

The achievement of reliability is a major task during the design process of microsystems (i.e. MEMS: mechanical-electrical microsystems). In this respect CAD (computer aided design) simulation methods play a major role in the dimensioning of mechanical structures. It can be observed that a pure CAD approach becomes difficult because of the complexity of these systems, which originates from the large variety of integrated materials and thus a diversity of the resulting failure mechanisms. Therefore strategies dealing with these uncertainties in reliability estimates need to be incorporated in the design process. The approach presented in this paper is based on the application of simulation and advanced deformation measurement methods named microDAC (micro deformation analysis by means of grey scale correlation) and nanoDAC. It is exemplified on different detail levels of the reliability assessment, with an emphasis on fracture. The first stage consists of a parametric si mulation approach, which helps to develop design guidelines for the geometry. For a more absolute quantitative analysis and for material selection in a new design the mechanical properties need to be specified and evaluated with respect to reliability. Besides, the described systematics of reliability assessment needs a profound knowledge of the failure behavior, which is analyzed by the application of microDAC/nanoDAC techniques. In the prescribed way, it becomes possible to tackle mechanical reliability problems in early design phases.