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"glassPack" - Photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

: Schröder, H.; Arndt-Staufenbiel, N.; Brusberg, L.


Institute of Electrical and Electronics Engineers -IEEE-:
2nd Electronics Systemintegration Technology Conference, ESTC 2008. Proceedings. Vol.2 : 1st - 4th September 2008, Greenwich, London, UK
Piscataway, NJ: IEEE, 2008
ISBN: 978-1-4244-2813-7
ISBN: 978-1-4244-2814-4
ISBN: 1-4244-2813-0
Electronics Systemintegration Technology Conference (ESTC) <2, 2008, London>
Fraunhofer IZM ()

The "glassPack"-concept will be introduced as a new packaging technologies platform for a wide area of optoelectronic applications like optical backplane, electricaloptical circuit boards (EOCB) and sensors. The usage of thin glass foils of some tens of microns thickness as substrate and interconnection material is the crucial point of the concept. First realizations will be presented.