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Design of 77 GHz interconnects for buried SiGe MMICs using novel system-in-package technology

: Richter, M.D.; Becker, K.-F.; Böttcher, L.; Schneider, M.

DOI: 10.1109/EUMC.2008.4751770

	European Microwave Association: 38th European Microwave Conference, 2008, EuMC 2008. Conference Proceedings : 27 - 31 October 2008, Amsterdam, Netherlands Piscataway, NJ: IEEE, 2008 ISBN: 978-2-87487-006-4 ISBN: 978-1-4244-3794-8 ISBN: 978-2-87487-005-7 S.1573-1576
	European Microwave Conference (EuMC) <38, 2008, Amsterdam>

	Englisch
	Konferenzbeitrag
	Fraunhofer IZM ()

Abstract
This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.

: http://publica.fraunhofer.de/dokumente/N-173012.html